Mar 15, 2023

CE attends signing ceremony of "Arrangement between the Mainland and Hong Kong on Expediting the Development of Hong Kong into an International Innovation and Technology Centre" in Beijing

The Chief Executive, Mr John Lee, speaks at the signing ceremony of "Arrangement between the Mainland and Hong Kong on Expediting the Development of Hong Kong into an International Innovation and Technology Centre" in Beijing today (March 15).
The Secretary for Innovation, Technology and Industry, Professor Sun Dong (front row, left), signed the "Arrangement between the Mainland and Hong Kong on Expediting the Development of Hong Kong into an International Innovation and Technology Centre" with Vice Minister of Science and Technology Professor Zhang Guangjun (front row, right) in Beijing today (March 15). The Chief Executive, Mr John Lee (back row, left) and the Minister of Science and Technology, Mr Wang Zhigang (back row, right), were present to witness the signing.
The Secretary for Innovation, Technology and Industry, Professor Sun Dong (first left), signed the "Arrangement between the Mainland and Hong Kong on Expediting the Development of Hong Kong into an International Innovation and Technology Centre" with Vice Minister of Science and Technology Professor Zhang Guangjun (first right) in Beijing today (March 15). The Chief Executive, Mr John Lee (second left) and the Minister of Science and Technology, Mr Wang Zhigang (second right), were present to witness the signing.
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